Glass Canada

News
Edgetech’s technical director to cover ‘Third Thermal Performance Parameter’ at Best2 Conference


March 11, 2010
By

Mar. 10, 2010 – With so much focus on U-factor and Solar Heat Gain Coefficient (SHGC) in the fenestration industry, little attention has been paid to the third thermal performance parameter: condensation resistance.

Mar. 10, 2010 – With so much focus on U-factor and Solar Heat Gain Coefficient (SHGC) in the fenestration industry, little attention has been paid to the third thermal performance parameter: condensation resistance. According to Tracy Rogers, technical director for Edgetech I.G., condensation can lead to health concerns and affect the integrity and long-term performance of building components. Rogers will present his findings at the Best2 Conference to be held April 12-14, 2010, in Portland, Oregon.

Rogers’ technical paper titled “Considerations for the Condensation Resistance of Fenestration Assemblies” provides an in-depth look at U-factor and condensation resistance basics, system ratings for thermal performance and the relative effects of U-factor and condensation resistance using third-party data.

Advertisment

“Performance factors that may have a minimal impact on U-factor and/or SHGC may be critical in the prevention of condensation formation that may, if not controlled, lead to health concerns and building component or system damage,” Rogers said. “At the Best2 Conference, I will compare the difference between the performance of fenestration products relative to U-factor and condensation resistance and outline principal design features to improve the latter.”

The Best2 Conference is a three-day event hosted by the Building Enclosure Council (BEC) in Portland. This year’s event will comprise three tracks: Energy Efficiency, Whole Building and Fenestration. Rogers will present his findings on Wednesday afternoon as part of the Fenestration track.

For more Edgetech news and upcoming events, visit www.edgetech360.com .

 


Print this page

Related



Leave a Reply

Your email address will not be published. Required fields are marked *

*